as we have manufactured batch with kollipho p188 and PEG by wet granulation these are core tablet and final form dont need coating . Problem is that it is showing spots due heat at blister can someone guide me to solve this
Are you facing this problem only for one batch or all the batches during packing??
Is any excipient used in the tablets has low melting point??
Based on your answer for above observation, please note following.
Suggested not to use blister packing (PVC-Aluminum) for this type of product.
Try for Alu-Alu blister pack where high temperature is not used. Normal temperature is required for this type of blister formation packing machine.
You are always welcome.